hilink: trace per-line 100-ohm USB series resistors, gate reversible HS test
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@@ -25,6 +25,11 @@ USB 2.0 EHCI port (`Sstar-ehci-1`).
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module input, inside the common 4.75–5.25 V input range. The earlier
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"3.3 V fed into the 5 V input" hypothesis is therefore ruled out **at
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module ingress** (upstream of the carrier's local regulation).
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- **Verified on hardware (2026-10, Piotr):** each USB data net was physically
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traced as `SSC338Q-side -> approximately 100 ohm series resistor ->
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RTL8812EU-module D+ or D-`; each component measured about 100 ohm across
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its own endpoints with all power removed. These are **two separate
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per-line series resistors**, not one 100-ohm differential termination.
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- RF/FEC configuration is not a USB fix and is out of scope for this issue.
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- This document contains no credentials, pairing or RF-access material.
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@@ -57,6 +62,16 @@ irrelevant (the audited paths cover what the shipped source programs, not
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the full register space), and it does **not** claim any high-speed success —
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the fault is unresolved; only its domain is now sharply bounded.
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**First concrete physical candidate:** the traced per-line ~100 ohm series
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resistors (see the hardware section below). FS signaling at 12 Mbit/s is
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edge-slow and tolerant, while HS chirp/negotiation is amplitude- and
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timing-critical, so excessive series damping on both lines is consistent
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with exactly this failure signature — FS survives, HS chirp is missed. This
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is a **hypothesis with a matching signature, not a proven root cause**, and
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the commonly seen external USB 2.0 series damping practice (roughly 15-33
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ohm) is **not** a substitute for the exact SSC338Q PHY/reference-design
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requirement, which is not documented in this repository.
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Operating posture while the fault stands: keep the existing
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4096 kbit/s limit appropriate to full-speed operation; do not raise it on
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the assumption of high-speed throughput until HS is actually demonstrated.
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@@ -245,19 +260,72 @@ scope:
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**Next physical gate (before any rework):**
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1. **Macro photographs of both sides** of the carrier/module.
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1. **Macro photographs of both sides** of the carrier/module — not yet
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reported.
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2. **Identify all four host pads** — determine which are VBUS, GND, D+,
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D- (the four-wire harness implies the classic set, but the actual
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assignment must come from tracing, not assumption).
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assignment must come from tracing, not assumption) — not yet reported in
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full; the two data nets and their series resistors have been traced (see
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the fixed observations above).
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3. **Trace D+/D- end to end**, identifying every intervening component —
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series resistors, ESD arrays, common-mode chokes, vias, connectors,
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harness wires — and where the pair leaves the board.
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harness wires — and where the pair leaves the board. **Status: performed
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for both data nets** — each net is `SSC338Q-side -> ~100 ohm series
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resistor -> module D+/D-`, each resistor measuring ~100 ohm across its
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own endpoints, de-energized. No other intervening component was reported
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on the data nets.
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**Safety rule for all continuity/ohmmeter work:** only with **all power
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removed and rails discharged** (unplug, then verify the rails are at 0 V
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before touching meter probes to pads). No powered measurements are proposed
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at this stage.
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### Gated, reversible experiment: reduce per-line series damping
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Rationale: if the ~100 ohm per-line series resistors over-damp the pair,
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reducing the effective per-line series resistance by roughly four times
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(100 ohm -> ~25 ohm) into the range of common external USB 2.0 practice may
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let the HS chirp/eye reach the host squelch/timing margins again. This is a
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**bounded, fully reversible test**, not a repair commitment: the target
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value below is an example chosen from common practice, **not** the
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documented SSC338Q PHY/reference-design requirement, which must be confirmed
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from vendor material if the test succeeds.
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Pre-flight gate (no soldering before this is done):
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1. Confirm the two resistors' **package size** and mark their **exact
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locations** (photograph before touching anything).
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2. Confirm the workmanship/ESD plan for soldering on the carrier.
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Experiment (reversible — nothing is removed, parts are added in parallel):
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1. With **all power removed and rails discharged and verified at 0 V**
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(same rule as above). The work setup itself must not be able to feed
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voltage onto the unpowered board — including through the soldering
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iron's supply path — so use an isolated or battery-powered iron or
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equivalent isolation. Solder **one matched resistor in parallel across
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each** existing 100 ohm part — **D+ and D- must be treated
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identically**.
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2. Example value: 33 ohm in parallel with 100 ohm gives an effective
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(33 x 100) / (33 + 100) = 3300 / 133 = **24.8 ohm per line** (~25 ohm).
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Any parallel pair follows R_eff = (R1 x R2) / (R1 + R2); keep the same
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value on both lines.
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3. Inspect under magnification for **bridges, solder balls or damage** to
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the parts and neighbours; the two lines must look identical.
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4. **Before restoring power**, measure each modified net again (de-energized)
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and confirm both read the same effective value, within part tolerance.
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5. Restore power **only after inspection** and run a fresh USB enumeration
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check (`cat /sys/bus/usb/devices/1-1/speed`).
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**Acceptance criterion:** actual **480** Mbit/s negotiation. The
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enumeration result is the only judge of this test: no final line impedance
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or eye-quality outcome is assumed without signal-integrity measurement (a
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later diagnostic above). If behaviour regresses in any way or HS is **not**
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achieved, **revert immediately**: remove the parallel parts to restore the
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original ~100 ohm per line, and record what was observed. Until HS is
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actually demonstrated, keep the **4096 kbit/s** operating limit (see the
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conclusion) regardless of this experiment.
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Further isolation diagnostics, only **after** the gate above (all of them
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need rework access — the radio is pad-connected, not socketed, so this may
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mean a temporary rework socket or piggyback harness):
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@@ -275,11 +343,14 @@ invalidates prior software observations; re-verify from the on-device
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commands below after any hardware change.
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Evidence status: the platform-driver re-probe (step 5 below), the
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input-supply-capacity change, and the module-input voltage measurement were
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performed on hardware (2026-10, Piotr) — none improved negotiation, and the
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ingress voltage is in range; all recorded above. The register-read
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diagnostics (steps 1-4 below) have not been reported yet; no HS negotiation
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has been observed at any point, and this document does not claim any.
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input-supply-capacity change, the module-input voltage measurement, and the
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per-line series-resistor tracing (de-energized resistance checks) were
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performed on hardware (2026-10, Piotr) — none of the software-adjacent
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steps improved negotiation, the ingress voltage is in range, and the traced
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topology is as recorded above. The parallel-resistor experiment **has not
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been performed yet**; the register-read diagnostics (steps 1-4 below) have
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not been reported yet. No HS negotiation has been observed at any point,
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and this document does not claim any.
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## On-device verification (read-only diagnostics; step 5 re-probe already completed on hardware)
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